IC & Sensor Packaging Technology Expo 2024
Exhibition

IC & Sensor Packaging Technology Expo 2024

24.01.2024 - 26.01.2024 Tokyo, Japan, Tokyo Big Sight - International Exhibition Center
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Category: Packing & Packaging
Organizer: Reed Exhibitions Japan Ltd.
Exhibition center: Tokyo Big Sight - International Exhibition Center

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Tokyo Big Sight - International Exhibition Center

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Overview interest facts - IC & Sensor Packaging Technology Expo 2024

IC & Sensor Packaging Technology Expo is Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. It will feature Assembly Equipment, Packaging Materials, MEMS Device Manufacturing Equipment and, etc.

Overview of exhibitors / visitors - IC & Sensor Packaging Technology Expo 2024

Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.

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