|Category:||Packing & Packaging|
|Organizer:||Reed Exhibitions Japan Ltd.|
|Exhibition center:||Tokyo Big Sight - International Exhibition Center|
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Overview interest facts - IC & Sensor Packaging Technology Expo 2024
IC & Sensor Packaging Technology Expo is Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. It will feature Assembly Equipment, Packaging Materials, MEMS Device Manufacturing Equipment and, etc.
Overview of exhibitors / visitors - IC & Sensor Packaging Technology Expo 2024
Profile for exhibit include Assembly Services, Assembly Equipment, Inspection Equipment, Testers, Measurement Packaging Materials, Components, Other Packaging Technology Packaging Sourcing, Related Services, Semiconductor Packaging Analysis Software, Other IC Packaging Technology Information, Industrial Journals.
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