International Wafer Level Packaging Conference 2023
Exhibition

International Wafer Level Packaging Conference 2023

14.02.2023 - 16.02.2023 Fremont, USA, Fremont Marriott Silicon Valley
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Category: IT & Technology
Organizer: Surface Mount Technology Association (SMTA)
Exhibition center: Fremont Marriott Silicon Valley

Overview interest facts - International Wafer Level Packaging Conference 2023

International Wafer Level Packaging Conference brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. The International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends.

Overview of exhibitors / visitors - International Wafer Level Packaging Conference 2023


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