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| Category: | IT & Technology |
|---|---|
| Organizer: | Surface Mount Technology Association (SMTA) |
| Exhibition center: | Fremont Marriott Silicon Valley |
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Overview interest facts - International Wafer Level Packaging Conference 2023
International Wafer Level Packaging Conference brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. The International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution. The conference has a rich history of bringing together attendees from over 16 countries in the heart of Silicon Valley to immerse themselves in the latest technology and business trends.
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